Epoxy Resin Filling Liquid Cold Plate Manufacturing
Epoxy Resin Filling Liquid Cold Plate Manufacturing
Blog Article
Epoxy Resin Filling Liquid Cold Plate Manufacturing is an advanced heat dissipation technology designed for efficient thermal management needs in industries such as high-power electronic equipment, medical equipment, data centers, and new energy vehicles. Its core feature is the use of Liquid cooling plate technology, combined with high thermal conductivity Epoxy resin thermal conductivity filling materials to ensure maximum heat dissipation efficiency, optimize the operating temperature of the equipment, and improve overall reliability.
During the heat dissipation process, the liquid cold plate removes heat from the heat source through the circulation of coolant, and reduces thermal resistance through epoxy resin filling technology, enhancing heat dissipation capabilities, making it a key component of the High-performance liquid cooling system.
Working Principle
Epoxy Resin Filling liquid cold plate uses copper or aluminum alloy as the base material, and designs a precise pipe structure inside to allow the coolant to circulate in the pipe. In order to optimize the heat conduction path, the gap between the pipe and the metal plate is filled with epoxy resin with high thermal conductivity, which effectively reduces thermal resistance and improves the overall heat conduction efficiency.
The entire heat dissipation process is as follows:
Electronic devices or other heating elements generate a lot of heat when they are running.
The coolant inside the liquid cooling plate flows through the pipes and quickly absorbs the heat generated by the heat source.
Through the optimized flow channel design, the heat is evenly transferred to the coolant and taken away to the external radiator for release.
Due to the presence of the epoxy resin filling layer, the thermal resistance between the cooling pipe and the metal plate body is significantly reduced, so that the heat energy is more effectively transferred from the equipment to the cooling system, improving the heat dissipation efficiency.
Product Features
Epoxy resin thermal conductivity improves heat transfer efficiency
Use high thermal conductivity epoxy resin to fill the gap between the cooling pipe and the metal plate, effectively reducing thermal resistance and improving overall thermal conductivity.
With high thermal conductivity, filling materials with different thermal conductivity coefficients can be customized according to needs to meet the heat dissipation needs of high-power equipment.
Liquid cooling plate optimizes heat dissipation path
Compared with traditional air cooling systems, liquid cooling plates have higher cooling efficiency and can take away the heat generated by heating components faster.
By optimizing the coolant flow path, ensure that the coolant evenly covers the heating area and improves the uniformity of heat dissipation.
Heat dissipation enhances equipment stability
Through liquid cooling plate technology, ensure that the temperature of the equipment is maintained within a safe range during long-term operation to prevent performance degradation or damage caused by overheating.
Especially suitable for scenes with extremely high heat dissipation requirements such as high-density computing equipment, high-power lasers, and high-power inverters.
High-performance liquid cooling system adapts to a variety of complex environments
Using industrial-grade coolant, it can adapt to harsh working environments such as extreme high temperature and high humidity.
Compatible with different cooling systems, such as closed-loop cooling, external circulation cooling, etc., and can be customized according to needs.
Corrosion resistance and long life
Aluminum alloy or brass is used as the base material of the liquid cooling plate, which has excellent corrosion resistance and oxidation resistance, ensuring that it is not easy to damage during long-term use.
The coolant channel is reasonably designed to avoid sediment and blockage problems, simple maintenance, and extend service life.
Compact design, suitable for space-constrained applications
Due to the use of epoxy resin filling technology, the liquid cooling plate can be more closely combined with the cooling pipe to reduce space occupancy.
Suitable for high-power but compact equipment, such as servers, aerospace electronic equipment, electric vehicle battery cooling systems, etc.
Main advantages
Greatly improve heat dissipation efficiency
Combined with Liquid Cold Plate and epoxy resin high thermal conductivity filling technology, the heat dissipation efficiency is improved by 30%-50% compared with traditional air cooling or ordinary liquid cooling solutions.
Reduce equipment energy consumption
Due to the efficient thermal management system, the energy consumption of traditional cooling systems such as fans is reduced, the overall power consumption is reduced, and energy utilization is improved.
Customized design to meet different heat dissipation needs
The pipeline layout, epoxy resin filling thickness and material selection can be flexibly adjusted according to the power density, heat load and space requirements of different equipment.
Improve equipment stability and service life
Through precise temperature control, the performance degradation or failure of the equipment due to overheating is avoided, and the long-term operation reliability is improved.
Environmentally friendly materials, in line with international standards
Use thermally conductive epoxy resin and coolant that meet environmental standards, and comply with international environmental regulations such as RoHS and REACH.
Scope of application
Epoxy Resin Filling Liquid Cold Plate is suitable for multiple high power density industries and application scenarios with high efficiency heat dissipation requirements, including but not limited to:
1. Medical equipment
CT scanners, MRI (nuclear magnetic resonance imaging): ensure stable heat dissipation of imaging equipment under long-term operation and improve imaging quality.
Laser therapy device: ensure efficient heat dissipation of the laser and maintain precise treatment temperature.
High-end analytical instruments: such as DNA sequencers, PCR amplifiers, etc., have extremely high requirements for temperature control, and liquid cooling plates can provide a stable heat dissipation environment.
2. High-power electronic equipment
Inverter, IGBT module: in power electronic equipment, ensure efficient heat dissipation of high-power semiconductor modules to prevent overheating damage.
High-performance LED lighting: used for industrial lighting and stage lighting, extending LED life and improving light efficiency.
3. Data center and high-performance computing
Server, GPU computing cluster: suitable for high-density computing equipment, improving computing efficiency and reducing overall energy consumption.
AI computing, supercomputing center: optimize the heat dissipation requirements of artificial intelligence training and big data computing, and improve computing stability.
4. Aerospace electronic equipment
Satellite electronic system: ensure stable operation of electronic equipment in extreme temperature environments.
Radar and avionics: reduce heat dissipation problems of electronic equipment and improve the reliability of combat and communication equipment.
5. New energy industry
Electric vehicle battery cooling: optimize battery temperature control, extend battery life and improve safety.
Hydrogen fuel cell heat dissipation: ensure stable operation of fuel cells and improve energy efficiency.
Epoxy Resin Filling Liquid Cold Plate Manufacturing combines key technologies such as epoxy resin thermal conductivity, liquid cooling plate, heat dissipation, and high-performance liquid cooling to provide efficient and stable thermal management solutions for high-power density equipment. Its excellent heat dissipation performance, low energy consumption, customized design and wide applicability make it an important component in the future high-performance electronic heat dissipation field.